This paper presents the design and optimization of a cooling system tailored for innovation building, focusing on maximizing energy efficiency while ensuring optimal thermal comfort for occupants. The proposed cooling system integrates several key components, including chillers, air handling units, distribution systems, and control mechanisms. The system utilizes a combination of centralized and decentralized cooling strategies to efficiently manage thermal loads across different zones within the building. Additionally, advanced control algorithms are employed to dynamically adjust cooling operations based on real-time data, occupant preferences, and external environmental conditions. The optimization process involves comprehensive simulation studies and performance evaluations using building energy modeling software and an Hourly Analysis Program (HAP). Various design parameters such as equipment sizing, layout configurations, air distribution patterns, and control strategies are iteratively refined to achieve the desired balance between energy efficiency, cost-effectiveness, and occupant comfort. The design and optimization of a cooling system for an Innovation building represents a critical step toward achieving sustainable and energy-efficient building operations. By leveraging advanced technologies and innovative design approaches, this cooling system offers a viable solution for addressing the cooling needs of Innovation buildings while mitigating the environmental impact associated with traditional HVAC systems. The proposed design was applied in a case study of an innovation building during the cooling seasons and the results of the optimization demonstrate significant improvements in energy consumption, with substantial reductions in both electricity demand and greenhouse gas emissions compared to conventional cooling systems. Furthermore, the proposed cooling system maintains consistent thermal conditions throughout the building, ensuring a comfortable indoor environment for occupants while minimizing the risk of thermal discomfort and overheating.
Primary Language | English |
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Subjects | Electronics, Sensors and Digital Hardware (Other) |
Journal Section | Articles |
Authors | |
Early Pub Date | October 14, 2024 |
Publication Date | September 30, 2024 |
Submission Date | February 18, 2024 |
Acceptance Date | March 13, 2024 |
Published in Issue | Year 2024Volume: 29 |